AIN intergrated circuit aluminum nitride ceramic custom made parts substrate supplier

Aluminum Nitride Ceramics:
Aluminum nitride, a covalent bond compound, is an atomic crystal belonging to a diamond-like nitride, a hexagonal system, a wurtzite crystal structure, non-toxic, white or grayish white. The AIN crystal is a covalently bonded compound with a [AIN4] tetrahedron as a structural unit, and has a wurtzite structure and is a hexagonal system. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or off-white, single crystal colorless and transparent, sublimation decomposition temperature under normal pressure is 2450 °C. It is a high temperature heat resistant material. Thermal expansion coefficient (4.0-6.0) X10-6/°C. Polycrystalline AIN has a thermal conductivity of 260 W/(m.k), which is 5-8 times higher than alumina, so it has good thermal shock resistance and can withstand extreme heat of 2200 °C. In addition, aluminum nitride is not attacked by aluminum liquid and other molten metals and gallium arsenide, and particularly has excellent corrosion resistance to molten aluminum liquid.

Aluminum Nitride Ceramics properties:
(1) high thermal conductivity (about 320W / m · K), close to BeO and SiC, more than 5 times that of Al2O3;
(2) The coefficient of thermal expansion (4.5 × 10 -6 ° C) is matched with Si (3.5 ~ 4 × 10 -6 ° C) and GaAs (6 × 10 -6 ° C);
(3) excellent electrical properties (dielectric constant, dielectric loss, volume resistivity, dielectric strength);
(4) good mechanical properties, higher flexural strength than Al2O3 and BeO ceramics, can be sintered at normal pressure;
(5) high purity;
(6) good optical transmission characteristics;
(7) non-toxic;
(8) It can be produced by a casting process. It is a promising high-power integrated circuit substrate and packaging material.

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