Design Features
Ultra-high thermal conductivity:
Thermal conductivity reaches 170–200 W/m·K, comparable to some metallic materials and far superior to traditional alumina ceramics.
Excellent insulation properties:
High volume resistivity, high voltage resistance, effectively isolating current, suitable for high-voltage power devices.
Suitable thermal expansion:
Coefficient of thermal expansion close to silicon (Si), suitable for matching with semiconductor chips, avoiding cracking
caused by thermal stress.
High temperature resistance and high strength:
Can operate stably for extended periods above 1000°C, with high mechanical strength and excellent resistance to thermal shock.
Chemical stability:
Stable to most acidic and alkaline environments, not easily oxidized or corroded, suitable for harsh operating conditions.
Customizable design:
We (Hyde Precision Ceramics) can process into different sizes, thicknesses, and shapes (blocks, strips, sheets) according to
customer needs to meet diverse heat dissipation applications.
Application areas
Semiconductor Devices:
IGBT Modules, Power Module Heatsink Bases
LED Optoelectronics Industry:
High-Power LED Heatsink Substrates, Thermally Conductive Substrates
Communication Equipment:
Heatsinking and Insulation Components for 5G Base Station Power Amplifiers
New Energy Industry:
Electric Vehicle Power Devices, Energy Storage System Modules
Medical and Scientific Research:
Heatsinking and Insulating Blocks in Laser Equipment and Precision Instruments
Aerospace and Military Industry:
High-Frequency Power Device Heatsinks and High-Voltage Insulation Bases
